Huawei CT016M501 Power Subrack Backplane Busbar Adapter Module (High-Current Blind-Mate) - Official Front View
HuaweiModel: CT016M501

Huawei CT016M501 Power Subrack Backplane Busbar Adapter Module (High-Current Blind-Mate)

The CT016M501 is a critical hardware component in Huawei indoor telecom power systems, integrating subrack backplane signal routing, high-current busbar power distribution, and low-voltage trip protection.

Pricing is confirmed by project configuration and quantity

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Rated Busbar Current
High-Current Busbar Integration
Interface Mating Type
Gold-Finger Blind-Mate
Core Protection Function
High-Current Low-Voltage Trip
Applicable Power System
Huawei Indoor Telecom Subrack
PCB Manufacturing Craft
Multi-Layer Immersion Gold Flame-Retardant Backplane
Maintenance & Expansion Feature
Hot-Swap & Rapid Expansion Support

What this product is

What this product is

Serving as the neural hub and power junction within the telecom subrack, this module densely integrates backplane interface conversion circuitry with high-purity copper busbars, providing stable electrical and mechanical support for rectifier modules and control units.

What problem it solves

Effectively resolves issues in traditional telecom subracks such as complex internal wiring, high thermal losses in high-current transmission, mechanical wear from frequent hot-swapping, and delayed system-level low-voltage disconnect during deep battery discharge.

Who and where it is for

Widely applicable for capacity expansion and baseline hardware maintenance of Huawei outdoor cabinets and indoor telecom embedded power systems (such as 30A/50A/100A power subsystems).

Core advantages

  • Precision Gold-Finger Blind-Mate: Supports high-frequency hot-swapping for rectifiers and controllers with minimal contact resistance and anti-vibration wear resistance.
  • Lossless High-Current Busbar: Integrated thick copper busbar design effectively minimizes temperature rise and ohmic losses during parallel high-current transmission.
  • Intelligent Low-Voltage Trip Integration: Built-in precision low-voltage monitoring hardware trigger chain ensures fast and secure system cutoff during critical battery over-discharge.
  • Carrier-Grade High-Reliability Backplane: Multi-layer PCB immersion gold manufacturing offers superior UL flame retardancy and exceptional electromagnetic interference (EMI) protection.

Technical specifications

Key specificationsValue
Rated Busbar CurrentHigh-Current Busbar Integration
Interface Mating TypeGold-Finger Blind-Mate
Core Protection FunctionHigh-Current Low-Voltage Trip
Applicable Power SystemHuawei Indoor Telecom Subrack
PCB Manufacturing CraftMulti-Layer Immersion Gold Flame-Retardant Backplane
Maintenance & Expansion FeatureHot-Swap & Rapid Expansion Support

Applications

01

Outdoor Macro 4G/5G Telecom Power System

02

Core Optical Transport & Telecom Switching Center

03

Industrial SCADA & Substation DC Power Supply

Frequently asked questions

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