Question 1

What are the core electrical power specifications and optical CPRI/eCPRI transmission parameters of the ZTE ZXSDR B8300 BBU?

Accepted Answer

The ZTE ZXSDR B8300 operates on a telecom-grade -48V DC power system (operational voltage range: -40V DC to -57V DC) featuring dual-feed 1+1 redundant power modules (PM). The typical chassis power consumption ranges from 300W to 650W depending on board configurations, with maximum full-load power ≤ 800W. For baseband-to-RRU connectivity, the high-speed passive backplane works with baseband boards (such as UBPG, BPK, and BPN series) utilizing SFP/SFP+ transceivers. It supports CPRI line bit rates from Option 2 through Option 8/10 (up to 24.33 Gbps) as well as eCPRI. The standard optical transmission reach spans 10 km to 20 km over single-mode fiber (1310nm/1550nm) and can be extended up to 40 km via WDM architectures, eliminating feeder line losses and reducing footprint.

Question 2

How does the ZXSDR B8300 slot architecture handle GSM/UMTS/LTE/5G multi-mode co-existence and smooth capacity expansion?

Accepted Answer

Engineered with a 3U 19-inch rack-mount profile, the ZXSDR B8300 features a modular backplane offering dedicated slots for redundant Main Control & Switching boards (CC/CC16/CC17 in active/standby mode), up to 6 universal baseband processing slots, fan trays (SA/FA), and power modules (PM). With hundreds of Gbps non-blocking switching throughput across the backplane, it natively enables GSM, UMTS, LTE FDD/TDD, and 5G NR co-chassis operation. Capacity expansion is achieved without chassis replacement: operators can hot-swap or mix-and-match specialized processing boards (e.g., adding BPN2 boards for 5G NR deployment alongside UBPG3 boards for legacy 2G/3G/4G traffic). Dynamic microcode upgrades on the control board ensure a completely seamless migration path.

Question 3

What are the thermal design, surge protection, and MTBF reliability metrics of the B8300 under demanding site conditions?

Accepted Answer

Engineered for both telecom equipment rooms and outdoor integrated telecom cabinets, the ZTE B8300 supports an operating temperature range of -20°C to +55°C and relative humidity from 5% to 95% non-condensing. The thermal subsystem relies on hot-swappable intelligent fan trays featuring PWM speed modulation and multi-point thermal sensors, delivering high-efficiency forced-air cooling that maintains full-load operation even during single-fan failure. Electrically, the power feed modules feature comprehensive protection against overvoltage, undervoltage, overcurrent, short circuits, and reverse polarity, fully meeting IEC 61000-4-5 surge immunity requirements (2kV differential mode, 4kV common mode). The system delivers a carrier-grade MTBF exceeding 320,000 hours with 99.999% availability.

Key specifications	Value
Board Type	Standard 3U rack-mounted carrier-grade wireless distributed base station indoor baseband unit (BBU) chassis
Port Density & Specs	Multi-slot modular high-density backplane architecture (supports hot-swapping of the main control and switching board, baseband board, and power module)
Supported Chassis	Supports smooth evolution with GSM / UMTS / LTE / 5G multimode operation in one chassis
Subscriber Capacity	Long-distance fiber-optic extension of the RRU radio frequency unit, significantly reducing equipment-room footprint and feeder loss
Typical Power Consumption	Dual Redundant DC Power Supply (-48V DC) W
Operating Temperature	-20°C ~ +55°C

ZTE ZXSDR B8300 Multi-Mode Baseband Unit (3U Rack-Mount BBU Chassis)

What this product is

What this product is

What problem it solves

Who and where it is for

Core advantages

Technical specifications

Applications

Carrier cellular macro base station rooms

High-density indoor cellular distribution

Railway and industrial wireless networks

Frequently asked questions

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