Question 1

What are the core electrical parameters and RF interface specifications of the ZTE BPL1 baseband board?

Accepted Answer

The ZTE BPL1 (SKU: ZTE-BBU-BPL1-BOARD) is engineered for multi-carrier LTE-FDD/TDD processing. It features a typical power consumption under 55W, powered by a standard -48V DC backplane (operational range -40.5V to -57V DC). The board integrates multiple high-speed SFP/SFP+ optical ports compliant with CPRI v4.2/v5.0 specifications, delivering serial line rates of 2.4576Gbps, 4.9152Gbps, 6.144Gbps, and 9.8304Gbps. It directly couples with remote RRU units, supporting unrepeatered single-mode optical link distances of 10km to 20km while executing high-throughput physical layer baseband modulation, coding, and multi-antenna MIMO operations.

Question 2

Which BBU chassis platforms support the ZTE BPL1, and is it compatible with hybrid slot configurations?

Accepted Answer

The ZTE BPL1 board is designed specifically for ZTE ZXSDR B8200 and B8300 modular baseband chassis, occupying standard baseband payload slots (Slots 0 to 5). It fully supports hot-swapping, hardware thermal limits, and backplane load balancing. In heterogeneous deployments, the BPL1 seamlessly coexists alongside legacy and alternative boards like BPK1, BPL2, and UBRM. System synchronization and carrier aggregation are orchestrated by master clock and control units (e.g., CC, CC16, CC17), allowing hitless capacity expansion without disrupting active live site traffic.

Question 3

How are the environmental tolerance, thermal management, and surge protection engineered on the ZTE BPL1?

Accepted Answer

The ZTE BPL1 operates within a temperature threshold of -10°C to +55°C (storage from -40°C to +70°C) and handles 5% to 95% relative non-condensing humidity. Thermal dissipation utilizes the chassis forced-air cooling tunnel paired with an integrated high-thermal-conductivity aluminum heatsink and digital temperature sensors for real-time telemetry. Electrically, all I/O interfaces adhere to IEC 61000-4-5 surge immunity and ITU-T K.20/K.45 telecom protection criteria. Optical ports feature input power protection, while backplane high-speed SERDES traces incorporate ESD suppressors for stable deployment in rugged outdoor macro cabinets.

Key specifications	Value
Board Type	LTE-FDD/TDD multi-carrier baseband processing board
Port Density & Specs	Equipped with a high-speed fiber-optic CPRI interface for direct remote connection to RF RRU units
Supported Chassis	ZTE ZXSDR B8200 / B8300 series baseband subracks
Subscriber Capacity	Supports high-capacity LTE carrier aggregation computing
Typical Power Consumption	< 55 W
Operating Temperature	-10°C ~ +55°C

ZTE BPL1 LTE Baseband Processing Board (For ZXSDR BBU Systems)

What this product is

What this product is

What problem it solves

Who and where it is for

Core advantages

Technical specifications

Applications

Carrier LTE macro and micro cell sites

Smart utility private wireless networks

Port and industrial automation base stations

Frequently asked questions

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